Henniker Plasma has announced the latest and most reliable solutions for reducing wire bonding failures.
Vitaly Podeyev pozdeevvs - stock.adobe.com
silicon wafer with printed electronic circuit
Super macro shot of silicon wafer with printed electronic circuit
Wire bonding is a technique used when creating electrical interconnections between semiconductors, integrated circuits and silicone chips using fine wires.
Wire bond failure can occur when the fine wire bonds are unable to connect efficiently to a bond pad. Halogen and silicone contamination can cause corrosion and impede adhesion.
The lead frames used in the semiconductor device assembly process need to be completely contaminant free. Contamination on the contact surfaces of lead frames can cause a reduction in the quality and provide insufficient bond formation.
Plasma cleaning can be applied as an in-line solution e.g., prior to encapsulation, or as a batch processing step, with bespoke frame loading arrangements.
Batch processing involves parts being loaded into a plasma chamber. The process is quick and effective, taking no more than five minutes to complete the treatment.